Hardener for hot curing epoxy resin systems used in the composite, powder coating and adhesive industry Accelerator.
Product Name | Particle Size | Description | Application Areas |
Ecure 14 | 90%≤10 μm | Latency Hardener Economic | Adhesive Prepreg Powder Coating Ink |
Dyhard 100S | 98%≤10 μm | Latency Hardener | Adhesive Prepreg Powder Coating Ink |
Dyhard 100SH | 98%≤10 μm | Latency Hardener Excellent Fluidity | Adhesive Prepreg Powder Coating Ink |
Dyhard 100SF | 98%≤6 μm | Latency Hardener Smaller Partical size | Adhesive Prepreg Powder Coating Ink |
Dyhard OTB | 98%≤150μm | Substituted Dicyandiamide | High-gloss Powder Coating |
