Latent accelerator for hot curing of epoxy resin systems used in the composite, powder coating and adhesive industry.
Product Name | Particle Size | Description | Application Areas |
Ecure 20 | 98%≤15 μm | Organic Urea Latency Accelerator Economic | Adhesive Prepreg |
Dyhard UR200 | 98%≤10 μm | Organic Urea Latency Accelerator | Adhesive Prepreg |
Ecure 30 |
98%≤15 μm | Organic Urea Latency Accelerator, Economic No Halogen Curing Speed: Moderate |
Adhesive Prepreg |
Dyhard UR300 | 98%≤10 μm | Organic Urea Latency Accelerator, No halogen Curing Speed: moderate | Adhesive Prepreg |
Dyhard UR500 |
98%≤10 μm | Organic Urea Latency Accelerator No Halogen Non-poisonous Water-solubility, Curing Speed: Fast | Adhesive Prepreg Water-base paint |
Dyhard MI-C |
| Dimethylimidazole | CCL Powder Coating |
